The 2020 National Science and technology award conference was grandly held in Beijing today. A total of 264 projects, 10 scientific and technological experts and 1 international organization were selected. Among them, 2 were awarded the national highest science and Technology Award; 46 National Natural Science Awards, including 2 first prizes and 44 second prizes; 61 national technological invention awards, including 3 first prizes and 58 second prizes; 157 National Science and technology progress awards, including 2 special awards, 18 first prizes and 137 second prizes; 8 foreign experts and 1 international organization will be awarded the international science and Technology Cooperation Award of the people's Republic of China.
Professor Liu Sheng, chairman of our company, won the first prize of the national science and Technology Progress Award for the team project "key technology and complete set process of high density and high reliability electronic packaging"!
Microelectronics industry is the source of global economic development. Electronic packaging is known as the "bone, muscle, blood vessel and nerve" of chips, which is the fundamental guarantee to improve the performance of chips. With the chip getting smaller and higher density, high-density chip packaging is prone to warpage and heterogeneous interface cracking, resulting in common industrial problems such as low yield and short service life.
Electronic packaging technology innovation is an important breakthrough for the development of China's integrated circuit industry to get rid of difficulties. At the beginning of the project, China's electronic packaging industry lacked core technology, and advanced technology and equipment were monopolized by developed countries. In view of the major common technical problems perplexing the development of the packaging industry, the team has broken through the bottleneck of high-density and reliable electronic packaging technology after more than 20 years of joint research by schools, institutes and enterprises. Aiming at the low yield caused by high-density chip packaging warpage and heterogeneous interface cracking, the team proposed the chip packaging structure and process multi field and multi-scale collaborative design method and series verification method, which were applied to the development of independently controllable chips in 5g communication and other fields, conquered the new wafer level fan out packaging process, and broke through the core technology of 7Nm CPU chip packaging. The project has solved the problems of "hollowing out" and "sticking neck" of intellectual property rights in the electronic packaging industry, occupied the technological commanding height of the industry, realized the transformation of high-density and high-reliability electronic packaging from scratch and from traditional packaging to advanced packaging, and has international competitiveness.
The team cooperated with major enterprises and scientific research institutions in the domestic industry to form a national IC packaging and testing industry chain technology innovation strategic alliance; The project completion unit cooperated with domestic enterprises to develop a series of packaging and testing equipment, and established a number of packaging flexible production lines; More than 300 kinds of products cover 12 industries such as communication, automobile and national defense.